ESD Moisture Barrier Bag for Wafer PCB Packing

• Customization: Available
• Industrial Use: Food, PCB, Wafer
• Transparency: Opaque
• Model NO.: MBB001
• Layered: Heat Seal
• Hardness: Soft
• Basic Level: Pet/Al/Ny/PE
• Heat Seal: LLDPE
• Functional Layer: AL
• Packaging: Bag
• Bag Sealing Methods: Flat Bag Packaging
• Transport Package: Carton and Pallet
• Specification: customized
• Trademark: Winet
• Origin: China
• HS Code: 392321

Product Description

ESD Moisture Barrier Bag is widely used in vacuum packing of static sensitive electronic components, precise equipment, chemical raw material and medical intermediate etc.

Application:
ESD Moisture Barrier Bag is mainly applied to pack PCB, wafer, IC, large precise mechanical equipment, chemical raw material, medical intermediate, food and so on.

Features:

1. It is made of 3 or 4-layer laminated film. This film is featured of good moisture barrier and UV-light isolation property.

2. Different bag types are available as zip-lock bag, flat open bag, gusset bag, 3D large bag and round-bottom bag etc.

3. Film thickness and structure can be customized with enough MOQ.

Service and quality control  

1. We can support customers to print their logo or product introduction etc. with customers' authorization certificate.

2. Various thickness and special material structure can be customized.

3. The third-party testing reports are available such as ROHS and Halogen etc.

Material Structure:

Specification

 

Material Composition	PET/AL/NY/PE
Inner Surface Resistance	ANSI ESD-STM-11.11	≤ 10^11 ohm
Outer Surface Resistance	ANSI ESD-STM-11.11	≤ 10^11 ohm
Decay Time	IEC61340-5-1(±1000V~±100V)	< 2s
Friction Voltage		< 100V
WVTR	ASTM F1249-2013	< 0.0003g/100in^2/24hs
OTR	ASTM D3985-2017	< 0.01cc/100in^2/24hs

 

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